LH612
Resolution
640×512
Pixel Pitch
12 μm
NETD
<30 mK
Uncooled Thermal Modules

LH612

COIN612 adopts state-of-the-art 12μm VOx microbolometer technology and integrates 640×512 wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.

Detector & Imaging
Resolution (Array Format)640×512
Pixel Pitch12 μm
FPA TypeVOx Microbolometer (WLP)
Spectral Range8 ~ 14 μm
WavebandLWIR
Cooling MethodUncooled
Optical Performance
NETD (Sensitivity)<30 mK
Frame Rate25/50 Hz
Dynamic Range14 bit
Focus ModeFixed Focus
Shutter / NUCInternal FFC Shutter
Electrical
InterfaceUSB / LVDS
Output FormatUSB RAW / LVDS 14-bit
Power Consumption<2 W
Input Voltage3.3 ~ 5 V DC
Environmental & Physical
Operating Temperature-40°C ~ +60°C
Storage Temperature-55°C ~ +85°C
Dimensions (W×H×D)50 × 50 × 25 mm
Weight≤ 55 g
Full Datasheet

Complete Technical Specifications

All parameters for LH612 — suitable for system integration and procurement reference.

Detector & Imaging

Resolution (Array Format)640×512
Pixel Pitch12 μm
FPA TypeVOx Microbolometer (WLP)
Spectral Range8 ~ 14 μm
WavebandLWIR
Cooling MethodUncooled

Optical Performance

NETD (Sensitivity)<30 mK
Frame Rate25/50 Hz
Dynamic Range14 bit
Focus ModeFixed Focus
Shutter / NUCInternal FFC Shutter

Electrical

InterfaceUSB / LVDS
Output FormatUSB RAW / LVDS 14-bit
Power Consumption<2 W
Input Voltage3.3 ~ 5 V DC

Environmental & Physical

Operating Temperature-40°C ~ +60°C
Storage Temperature-55°C ~ +85°C
Dimensions (W×H×D)50 × 50 × 25 mm
Weight≤ 55 g
Need the Full Datasheet?
Contact us to receive the complete product datasheet, dimensional drawings, and integration guide.
Request Datasheet
Get a Quote

Product Consultation

Interested in LH612? Fill in the form below and our experts will get back to you within 24 hours.

0/500

By submitting this form, you agree to our privacy policy. We respond within 24 business hours.