LH417
Resolution
384×288
Pixel Pitch
17 μm
NETD
<40 mK
Uncooled Thermal Modules

LH417

COIN417G2 uncooled IR imaging module, new generation version integrating 384×288/17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.

Detector & Imaging
Resolution (Array Format)384×288
Pixel Pitch17 μm
FPA TypeVOx Microbolometer (WLP)
Spectral Range8 ~ 14 μm
WavebandLWIR
Cooling MethodUncooled
Optical Performance
NETD (Sensitivity)<40 mK
Frame Rate25 Hz
Dynamic Range14 bit
Focus ModeFixed Focus
Shutter / NUCInternal Flat Field Correction (FFC)
Electrical
InterfaceUSB / UART
Output FormatUSB RAW / YUV
Power Consumption<1.5 W
Input Voltage3.3 ~ 5 V DC
Environmental & Physical
Operating Temperature-40°C ~ +60°C
Storage Temperature-55°C ~ +85°C
Dimensions (W×H×D)40 × 40 × 22 mm
Weight≤ 30 g
Full Datasheet

Complete Technical Specifications

All parameters for LH417 — suitable for system integration and procurement reference.

Detector & Imaging

Resolution (Array Format)384×288
Pixel Pitch17 μm
FPA TypeVOx Microbolometer (WLP)
Spectral Range8 ~ 14 μm
WavebandLWIR
Cooling MethodUncooled

Optical Performance

NETD (Sensitivity)<40 mK
Frame Rate25 Hz
Dynamic Range14 bit
Focus ModeFixed Focus
Shutter / NUCInternal Flat Field Correction (FFC)

Electrical

InterfaceUSB / UART
Output FormatUSB RAW / YUV
Power Consumption<1.5 W
Input Voltage3.3 ~ 5 V DC

Environmental & Physical

Operating Temperature-40°C ~ +60°C
Storage Temperature-55°C ~ +85°C
Dimensions (W×H×D)40 × 40 × 22 mm
Weight≤ 30 g
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